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Base Substrate Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

Base Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. モリマーエスエスピー 本社 Osaka//Resin/Plastic
  2. 共栄電資 Tokyo//Electronic Components and Semiconductors
  3. シライ電子工業 Shiga//Electronic Components and Semiconductors
  4. 4 京写 Kyoto//Consumer Electronics
  5. 5 三和電子サーキット Osaka//Electronic Components and Semiconductors
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Base Substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Metal base substrate モリマーエスエスピー 本社
  2. Aluminum base substrate [Noise and heat countermeasures with aluminum grounding] 共栄電資
  3. High thermal conductivity substrate / aluminum base substrate / copper base substrate シライ電子工業
  4. 4 Copper base / aluminum base substrate ダイワ工業
  5. 4 [Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing. 共栄電資

Base Substrate Product List

1～12 item / All 12 items

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Copper base / aluminum base substrate

Copper base / aluminum base substrate

The thermal conductivity can support up to 10W! Introducing a single-sided, one-layer metal substrate using a high thermal conductivity insulation layer.

We would like to introduce our "Copper Base/Aluminum Base Substrates." The "Copper Base" is a plain substrate without copper bumps. It features a high thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated together, suitable for high heat dissipation of LEDs. The "Aluminum Base Substrate" is compatible with aluminum substrate materials from various manufacturers. You can choose suitable materials from a wide lineup based on thickness, thermal conductivity, and more. 【Features】 <Copper Base> - No copper bumps - High thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated - Suitable for high heat dissipation of LEDs <Aluminum Base Substrate> - Compatible with aluminum substrate materials from various manufacturers - A wide selection of suitable materials available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.

[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND connection for the aluminum part ■ Dramatic improvement in the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing

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[Concerns about Device Assembly] The circuit board is thin and difficult to handle.

[Concerns about Device Assembly] The circuit board is thin and difficult to handle.

Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND for the aluminum part ■ Dramatic improvement in the utilization of the aluminum part ■ Automatic mounting with reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing

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Aluminum base substrate

Aluminum base substrate

We have products with thermal conductivity of 3 W/m·K and 10 W/m·K in stock, and we can also respond flexibly to other materials!

We would like to introduce the "Aluminum Base Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board has high thermal conductivity and excellent heat dissipation, making it suitable for components that require high heat dissipation, such as high-brightness LEDs and power devices. In recent years, the demand for high thermal conductivity materials has significantly increased due to the spread of LED lighting, and there has been a growing trend to adopt high-brightness LEDs for automotive headlights. 【Example Manufacturing Specifications for Aluminum Base Circuit Boards (Excerpt)】 ■ Maximum outer dimensions: 210×460mm ■ Copper foil thickness: 35μm ■ Insulation layer thickness: 80μm ■ Aluminum base thickness: 1.0mm, 1.5mm, 2.0mm ■ Thermal conductivity: 3W/m·K, 10W/m·K *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Achieving low cost! "Bendable aluminum base substrate"

Achieving low cost! "Bendable aluminum base substrate"

A low-cost aluminum base substrate that simultaneously achieves low thermal resistance and three-dimensional structure! It can be used in various LED products such as lighting and backlighting.

The flexible aluminum base substrate can be bent due to the insulating layer being made of film, enhancing design aesthetics and design freedom, and it is compatible with various three-dimensional processing. Additionally, Kyoha has achieved cost reduction through screen printing methods, responding to customer needs. 【Features】 ○ Low cost ... Achieved low pricing by manufacturing using our strength in screen printing technology. ○ Low thermal resistance ... High voltage resistant polyimide film is used for the insulating layer. ○ High reliability ... The insulating layer has no adhesive layer, eliminating concerns about resin degradation even in high-temperature environments. 【Main Applications】 ○ Automotive LED units (tail lights, turn signals, etc.) ○ LED lighting ○ LED backlighting *For more details, please contact us.

  • Printed Circuit Board

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Bending aluminum base substrate

Bending aluminum base substrate

Achieving cost reduction of curved aluminum substrates using screen printing technology! Capable of various three-dimensional processing!

Our "Bendable Aluminum Base Substrate" is a substrate that can be bent and retain its shape. It allows for 3D processing using plastic processing technology without cracking the insulating layer, enhancing design and design freedom. Additionally, it simultaneously achieves high insulation breakdown voltage and low thermal resistance. 【Features】 ■ The insulating layer does not crack even with 3D processing 　→ Enables 3D processing using plastic processing technology ■ Bendable aluminum substrate that retains its shape 　→ No need for attaching heat dissipation plates ■ Simultaneously achieves high insulation breakdown voltage and low thermal resistance 　→ Achieves 7kV with an insulating layer of 25μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Aluminum base substrate

Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored for various applications that require heat dissipation, with aluminum thickness options of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications requiring heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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Metal base substrate

Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

  • High frequency/microwave parts

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Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

  • img02.jpg
  • img04.jpg
  • img05.jpg
  • Printed Circuit Board
  • Circuit board design and manufacturing

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[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

  • img02.jpg
  • img04.jpg
  • img05.jpg
  • Printed Circuit Board
  • Circuit board design and manufacturing

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High thermal conductivity substrate / aluminum base substrate / copper base substrate

High thermal conductivity substrate / aluminum base substrate / copper base substrate

We provide metal base substrates that achieve high current and high heat dissipation.

- This is a substrate that can protect components from thermal destruction with high thermal conductivity and heat dissipation characteristics. (Base material nominal heat dissipation characteristic: 3.0 W/m·K or higher) - It offers high tracking resistance, ensuring electrical fire safety. (CTI value: 600 V or higher) - This substrate has high dielectric strength, allowing for safe use. (Through thickness dielectric strength: 3.0 kV / 100 μm) - UL certified.

  • Printed Circuit Board

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