We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Base Substrate.
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Base Substrate Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

Base Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. モリマーエスエスピー Osaka//Resin/Plastic 本社
  3. ダイワ工業 Nagano//Electronic Components and Semiconductors
  4. 4 京写 Kyoto//Consumer Electronics
  5. 5 三和電子サーキット Osaka//Electronic Components and Semiconductors

Base Substrate Product ranking

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]
  2. Metal base substrate モリマーエスエスピー 本社
  3. Copper base / aluminum base substrate ダイワ工業
  4. 4 Copper-based substrate アーセルデザイン
  5. 4 Aluminum base substrate 松和産業 本社

Base Substrate Product List

1~8 item / All 8 items

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Copper base / aluminum base substrate

The thermal conductivity can support up to 10W! Introducing a single-sided, one-layer metal substrate using a high thermal conductivity insulation layer.

We would like to introduce our "Copper Base/Aluminum Base Substrates." The "Copper Base" is a plain substrate without copper bumps. It features a high thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated together, suitable for high heat dissipation of LEDs. The "Aluminum Base Substrate" is compatible with aluminum substrate materials from various manufacturers. You can choose suitable materials from a wide lineup based on thickness, thermal conductivity, and more. 【Features】 <Copper Base> - No copper bumps - High thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated - Suitable for high heat dissipation of LEDs <Aluminum Base Substrate> - Compatible with aluminum substrate materials from various manufacturers - A wide selection of suitable materials available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Aluminum base substrate

We have products with thermal conductivity of 3 W/m·K and 10 W/m·K in stock, and we can also respond flexibly to other materials!

We would like to introduce the "Aluminum Base Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board has high thermal conductivity and excellent heat dissipation, making it suitable for components that require high heat dissipation, such as high-brightness LEDs and power devices. In recent years, the demand for high thermal conductivity materials has significantly increased due to the spread of LED lighting, and there has been a growing trend to adopt high-brightness LEDs for automotive headlights. 【Example Manufacturing Specifications for Aluminum Base Circuit Boards (Excerpt)】 ■ Maximum outer dimensions: 210×460mm ■ Copper foil thickness: 35μm ■ Insulation layer thickness: 80μm ■ Aluminum base thickness: 1.0mm, 1.5mm, 2.0mm ■ Thermal conductivity: 3W/m·K, 10W/m·K *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Bending aluminum base substrate

Achieving cost reduction of curved aluminum substrates using screen printing technology! Capable of various three-dimensional processing!

Our "Bendable Aluminum Base Substrate" is a substrate that can be bent and retain its shape. It allows for 3D processing using plastic processing technology without cracking the insulating layer, enhancing design and design freedom. Additionally, it simultaneously achieves high insulation breakdown voltage and low thermal resistance. 【Features】 ■ The insulating layer does not crack even with 3D processing  → Enables 3D processing using plastic processing technology ■ Bendable aluminum substrate that retains its shape  → No need for attaching heat dissipation plates ■ Simultaneously achieves high insulation breakdown voltage and low thermal resistance  → Achieves 7kV with an insulating layer of 25μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored for various applications that require heat dissipation, with aluminum thickness options of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications requiring heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

  • High frequency/microwave parts

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High thermal conductivity substrate / aluminum base substrate / copper base substrate

We provide metal base substrates that achieve high current and high heat dissipation.

- This is a substrate that can protect components from thermal destruction with high thermal conductivity and heat dissipation characteristics. (Base material nominal heat dissipation characteristic: 3.0 W/m·K or higher) - It offers high tracking resistance, ensuring electrical fire safety. (CTI value: 600 V or higher) - This substrate has high dielectric strength, allowing for safe use. (Through thickness dielectric strength: 3.0 kV / 100 μm) - UL certified.

  • Printed Circuit Board

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